Fuzhou Meiyang Optoelectronics: High-End Equipment Empowers a New Benchmark in Precision Manufacturing of Optical Components
The processing accuracy and quality stability of precision optical components are the core cornerstones for the high-end development of the optoelectronics industry. Fuzhou Meiyang Optoelectronics has long been deeply engaged in the optical component field, taking technological upgrading as the core driving force. It has proudly introduced two world-class pieces of equipment — the IBF ion beam finishing equipment ÅFiSy IFS300A and the birefringence stress meter Exicor 150AT. With their outstanding performance and precise adaptability, these devices provide an end-to-end solution for the manufacturing of medium and high-end optical components, covering everything from ultra-precision processing to quality inspection, demonstrating the company's professional strength and technological foresight in the optical manufacturing field.
ÅFiSy IFS300A: A Domestic Benchmark for Ultra-Precision Processing of Optical Components
As the top-selling high-end ion beam polishing equipment in China, the ÅFiSy IFS300A has achieved import substitution and domestic independent control, with a cumulative sales volume exceeding 40 units. It has gained repeated purchases and recognition from leading enterprises such as Fujing Technology, Huawei, and Changguang Satellite, becoming the preferred equipment for ultra-precision processing of optical components. Based on the principle of ion beam sputtering in a vacuum environment, the equipment achieves surface figuring through atomic-level material removal, with core advantages highlighted in technological advancement and application reliability.
In terms of core configuration, the equipment is equipped with an original German-imported IOT radio frequency ion source, combined with a patented Fraday cup + coordinate measuring probe system, enabling repeatable clamping and positioning accuracy of better than 5μm to accurately capture the processing benchmark of optical components. It adopts a three-layer graphite grid structure and a customizable diaphragm design, allowing flexible adjustment of beam spot size to meet the processing needs of optical components of different specifications. In terms of performance, the processing accuracy reaches PV≤15nm and rms≤0.5nm, the surface roughness can be as low as Ra≤0.3nm after combined process optimization, and the removal function stability exceeds 95%. The maximum error of peak efficiency during 8-hour continuous processing is only 2.76%, ensuring the consistency and reliability of mass production.
In terms of application adaptability, the equipment supports the processing of various optical materials such as quartz, sapphire, silicon carbide, and CaF₂, and is accurately compatible with optical components of complex structures including planar, spherical, aspherical, off-axis aspherical, and free-form surfaces. Its non-contact processing feature avoids edge effects and subsurface damage. Equipped with independently developed process control and calculation software, it is compatible with data interfaces of mainstream testing equipment such as Zygo interferometers. Through multiple rounds of iterative processing, it can significantly optimize the surface shape error of optical components, greatly improving their light transmittance and imaging quality, and providing key support for the R&D and production of core optical components such as high-end lenses, optical windows, and lithographic objectives.
Exicor 150AT: A Precise Guardian for Stress Detection of Optical Components
Residual stress is a key factor affecting the optical performance, mechanical stability, and service life of optical components. The Exicor 150AT, with its high-precision detection capability, has become the core equipment for quality control of optical components. Based on the principle of orthogonal polarized light detection, the equipment integrates advanced optical imaging and signal processing technologies to accurately capture the birefringence distribution and residual stress of optical components.
In terms of performance parameters, the equipment's birefringence measurement accuracy reaches ±0.1nm, and the stress measurement range covers 0-500MPa, enabling accurate identification of micro-stress changes in substrates and finished products such as optical glass, optical crystals, and polymer optical materials. Equipped with a high-resolution 1920×1080-pixel CCD camera and professional analysis software, it can visually present the stress distribution, providing intuitive data support for process optimization. In application scenarios, the equipment fully covers the incoming inspection of raw materials, in-process quality monitoring, and finished product performance evaluation of optical components. It supports the detection of optical components of various specifications and shapes, and is equipped with an adjustable sample stage to adapt to the testing needs of various products such as lenses, prisms, and optical windows, ensuring that every optical component meets the stringent standards of high-end applications.
The application of these two high-end pieces of equipment has not only improved Fuzhou Meiyang Optoelectronics' core equipment system in the field of optical component manufacturing but also achieved an overall capability upgrade from ultra-precision processing to precise inspection. In the future, Fuzhou Meiyang Optoelectronics will continue to rely on top-tier equipment and a professional technical team to provide customized optical component manufacturing solutions for customers. With precise and reliable products and services, it will empower the high-end development of the optoelectronics industry and help China's precision optical manufacturing industry reach new heights.
